Foundries converge on ASML’s High-NA roadmap

TSMC has committed to High-NA EUV for commercial advanced-logic manufacturing from 2030, while Samsung targets high-volume DRAM adoption in 2028 and Intel reports extensive operational use. Joint work on 12-inch photomasks targets a 2031 pilot line and 2033 production readiness, potentially lifting scanner productivity while deepening dependence on ASML’s specifications.