ASE Unveils Automated 310mm Panel-Level Packaging Line for AI and High-Performance Chips

Advanced Semiconductor Engineering has unveiled what it calls an industry-first automated 310mm × 310mm panel-level packaging production line, aimed at accelerating development of AI and high-performance computing hardware.

The new line is designed to enable a smoother transition from wafer-level to panel-level packaging. ASE says the larger panel format can improve economies of scale and material efficiency, while supporting higher throughput and shorter cycle times.

Those gains are significant for increasingly complex multi-die architectures used in AI accelerators and high-performance computing devices. As chip designs incorporate more components in advanced packages, packaging capacity and efficiency have become important factors in meeting demand for AI hardware.

The production line is slated to enter production in the first half of 2027.