Intel and 3DGS Plan $3.3 Billion Semiconductor Substrate Facility in Odisha

Intel and 3DGS are set to invest $3.3 billion in a semiconductor substrate manufacturing facility in Odisha, India, marking a significant development in the country’s effort to expand its role in advanced technology manufacturing.

The planned facility signals growing international confidence in India’s semiconductor ambitions. It also aligns with India’s strategic push to reduce dependence on imports and build a larger presence in the global semiconductor supply chain.

If carried through as announced, the investment would represent a major milestone for India’s effort to establish itself as a hub for semiconductor-related manufacturing, particularly in substrates, a key part of chip production and packaging.