MediaTek Client Chooses Intel Advanced Packaging for Custom AI Accelerator

MediaTek Inc. has disclosed that a data center client selected Intel Corp.’s embedded multi-die interconnect bridge, or EMIB, advanced packaging technology for an in-house customized artificial intelligence accelerator.

The decision marks the first adoption of Intel’s advanced packaging technology in MediaTek’s custom chip design portfolio. Analysts have suggested that Google is the unnamed client, according to the research summary, though MediaTek’s disclosure did not identify the customer.

The choice is notable because the client passed over TSMC for the project. The decision was reportedly driven by Intel’s cost savings and available capacity, pointing to a shifting competitive landscape in high-performance AI chip manufacturing and advanced packaging.